Crowded Space

Capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging persist, says TrendForce. 3nm  capacity—currently dominated by TSMC—has become even more constrained, Nvidia preemptively secured large volumes of 4/3 … The post Capacity constraints appeared first on Electronics Weekly.

Waldom today announced a major milestone in its sustainability efforts: 10 billion electronic components saved from landfills through its Green Stock Program. Since its launch, the Green Stock Program has transformed how the electronics industry manages excess inventory. Components deemed surplus by one distributor are often still fully functional and in demand elsewhere. By recirculating…

IollNIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the … The post NIST develops high temperature photonics packaging appeared first on Electronics Weekly.

While Germany and the Czech Republic have moved to fully legalize possession and home cultivation of cannabis , much of Eastern and Southeastern Europe still classifies cannabis as outright illegal. … The post The Hash Dilemma appeared first on Electronics Weekly.

The Vishay Sfernice 40 LHE is a linear position sensor with non contacting Hall effect technology, for high accuracy in harsh environments. Possible applciations include servo loop motion control systems … The post Vishay 40 LHE linear position sensor takes on harsh environments appeared first on Electronics Weekly.

Ubitium of Dusseldorf, the developer of a universal embedded processor, has taped-out its first silicon. “Our Universal Processor does it all – CPU, GPU, DSP, FPGA – in one chip, … The post A universal processor appeared first on Electronics Weekly.