Capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging persist, says TrendForce. 3nm capacity—currently dominated by TSMC—has become even more constrained, Nvidia preemptively secured large volumes of 4/3 …
The post Capacity constraints appeared first on Electronics Weekly.
Amphenol RF has expanded its portfolio of pre-configured cable assembly options with additional standard lengths for the popular SMA plug-to-SMA-jack configuration designed on 0.085-inch conformable cable. This high-frequency assembly provides … The post Amphenol RF adds lengths for SMA cable assembly configuration appeared first on Electronics Weekly.
The U.S. Space Force has fast-tracked the employment of the Deep Space Advanced Radar Capability (DARC), which involves a partnership of Australia, the UK and the United States. It says … The post DARC deep space radar gets early green light appeared first on Electronics Weekly.
Molex is to buy Teramount, the Israel-based fibre-to-chip connectivity specialist for Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount’s detachable, passive-alignment fibre-to-chip connectivity products for CPO enable faster data … The post Molex buys Teramount appeared first on Electronics Weekly.
The derivatives market is growing around the world, with energy and agricultural commodities leading the way. Derivatives allow investments in different commodities without buying these directly. They are also used … The post Derivatives appeared first on Electronics Weekly.
Cerebras, the wafer-scale AI chip developer, has put out a prospectus for investors in an upcoming IPO. According to the prospectus Cerebras had revenue of $510 million last year – … The post Cerebras files for IPO appeared first on Electronics Weekly.
Apple, 50 years old last week, became the world’s most valuable company in 2011,when it had a market cap of $340 billion. However, in 2024, propelled by the AI boom, … The post The Ten Most Valuable Companies appeared first on Electronics Weekly.
