What caught our eye this last week? There’s a Texan start-up taking on the European photonics wafer companies , a lone analyst going against the trend, and the space-based robotics of Gitai USA…
The post What caught your eye? Wafer production, Future Horizons forecast, Space robotics appeared first on Electronics Weekly.
What caught our eye these last seven days? Imec getting the world’s most advanced litho tool, Arm taking on Intel with a proprietary server CPU, and SWISSto12 3D printing GEO satellites… The post What caught your eye? Litho tool, Arm competition, GEO satellites appeared first on Electronics Weekly.
OKW has launched COMMUNITEC, an elegant new range of desktop/portable enclosures for large-format electronics. These smart modern enclosures are ideal for medical equipment, laboratory instrumentation, test and measurement, automation, fault analysis and quality control. Ergonomic COMMUNITEC features an integrated handle for easy portability. The front control panel is designed to accommodate 11.5″ to 14″ touchscreen…
The Q4 global connectivity market spanning mobile, fixed broadband and fixed voice, reached $333 billion, representing a 5% YoY growth. Full year revenues totalled $1.3 trillion in 2025, up 4% … The post Q4 connectivity market hits $333bn appeared first on Electronics Weekly.
Shrinking packaging, particularly with wire bond devices, and increasing automation, means that metrology has to adapt to meet the micro-level inspection required for reliable production lines. View Micro Metrology is … The post Metrology tools for wire bonded chips appeared first on Electronics Weekly.
Farnell has signed a worldwide distribution agreement with Same Sky, a manufacturer specialising in interconnect, audio, thermal management, motion and control, relay, sensor, and switch solutions. This partnership expands the … The post Farnell signs Same Sky appeared first on Electronics Weekly.
Microchip is releasing its BZPACK mSiC power modules, designed to meet High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. Power conversion They are available in topologies including half-bridge, … The post BZPACK mSiC power modules take on HV‑H3TRB harsh environments appeared first on Electronics Weekly.
