Ubotica partners with NOVI Space on AI-enabled Earth Observation

Yesterday Tim Cook, CEO of Apple, said would hand over to John Ternus (pictured) in September and take on the role of executive chairman. Cook has been CEO for 15 … The post Cook steps down as Apple CEO appeared first on Electronics Weekly.

Infineon has joined Nvidia’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI datacentres. Infineon’s power management products will support MGX architecture and 800 VDC power architecture, … The post Infineon joins Nvidia MGX 800VDC datacentre power architecture appeared first on Electronics Weekly.

Siemens’ Characteriser software for its Solido Simulation Suite  claims to accelerate .lib generation from weeks to days and deliver 7x greater throughput. The characteriser AI engine and advanced Liberty Variation … The post Characteriser accelerates .lib generation appeared first on Electronics Weekly.

ROHM is in mass production of a wireless power supply IC chipset consisting of the receiver – ML7670 – and transmitter – ML7671 – compatible with NFC technology for compact wearables … The post Wireless power supply IC for smart rings appeared first on Electronics Weekly.

Kyocera is bringing out a multilayer ceramic core substrate for semiconductor packages which are rapidly scaling in complexity as AI datacenter architectures evolve. Built from Kyocera’s proprietary Fine Ceramic materials, … The post New substrate for ceramic packages allows high density wiring and delivers greater rigidity appeared first on Electronics Weekly.

King Charles met tech CEOs yesterday at Blair House, the official guest house of the US government, where he is staying on his  trip to the US. Tim Cook, Jeff … The post King meets tech CEOs appeared first on Electronics Weekly.