Toshiba test-sampling 1200V SiC MOSFET

The United States Space Force (USSF) is cancelling its OCX programme to modernise GPS for both military and civilian positioning capabilities. Following delays and increasing costs, it has decided additional … The post Space Force axes OCX programme to update GPS appeared first on Electronics Weekly.

Q5D Technologies (Q5D), the specialist in robotic automation of wiring harness manufacture, and KYOCERA AVX today announced the latest phase of a three‑year collaboration to enable fully automated wire harness … The post Q5D and Kyocera extend custom IDC collaboration appeared first on Electronics Weekly.

Cerebras, the wafer-scale AI chip developer, has put out a prospectus for investors in an upcoming IPO. According to the prospectus Cerebras had revenue of $510 million last year – … The post Cerebras files for IPO appeared first on Electronics Weekly.

Shrinking packaging, particularly with wire bond devices, and increasing automation, means that metrology has to adapt to meet the micro-level inspection required for reliable production lines. View Micro Metrology is … The post Metrology tools for wire bonded chips appeared first on Electronics Weekly.

A consortium to develop the UK’s  first private-sector-led fusion power plant project has been formed by Type One Energy, Tokamak Energy, and AECOM. The UK Infinity Fusion Consortium  intends to … The post UK consortium to deliver fusion energy appeared first on Electronics Weekly.

The maritime 5G specialist JET Connectivity – based in Farnborough, Hampshire – is celebrating being awarded a place on Nato’s DIANA (Defence Innovation Accelerator for the North Atlantic) Mission Track … The post Nato selects JET Connectivity for DIANA innovation programme appeared first on Electronics Weekly.