Top Ten IDMs

The advanced packaging market reached $55 billion in 2025 and is expected to increase to more than $120 billion by 2031, says Yole. Advanced packaging is overtaking traditional packaging to […] The post Advanced packaging market to hit $120bn by 2031 appeared first on Electronics Weekly.

Kioxia has forecast a $7.91 billion profit for Q3 and plans to buy back 5.5% of its shares. The $5 billion cost of the buy-back is 170% of its planned […] The post Kioxia expects Q2 profit of $7.94 billion appeared first on Electronics Weekly.

Pixel-Flo, a spinout from the University of Sheffield’s School of Electrical and Electronic Engineering, has secured £5.25 million funding to enhance MicroLED technology manufacturing, helping to reduce the cost and … The post Sheffield University spin-off raises £5.25m to productionise MicroLED manufacturing process appeared first on Electronics Weekly.

Meta is  to put the third of its  multi-generational MTIA (Meta Training and Inference Accelerators) into production in September as part of its plan to  have 14GW of computing power … The post Meta prepares to fab its third custom datacentre chip appeared first on Electronics Weekly.

Newark’s global head of solutions, Cliff Ortmeyer, outlines the practical considerations engineers should consider when selecting electronics cooling technologies   Engineers approach thermal management as a primary design constraint. At a high level, every design starts with assumptions about available power, enclosure type and operating environment. These factors define the thermal envelope and influence decisions throughout the development process.   Maintaining thermal margin helps extend operational…

Agentic engineering is reshaping chip and system design and Nvidia is putting itself at the core of this movement with a concerted effort to deliver the tools and libraries designers […] The post Nvidia says agentic AI is reshaping chip system design appeared first on Electronics Weekly.