Strong execution at RS

Researchers at the University of Birmingham have come up with a novel method for producing conductors, semiconductors and electronic insulators uses vibrational energy to ‘split’ and ‘peel off’ molecular-thin layers … The post Birmingham scientists find new way to build 2D materials appeared first on Electronics Weekly.

ChangXin Memory Technologies (CXMT)  saw Q1 revenues rise 700% to $7.5 billion for a profit of  $1.26 billion. In Q1 2025 it made a loss. CXMT forecast an H1 revenue … The post CXMT revenue up 700% appeared first on Electronics Weekly.

MIPS,  which was bought by Globalfoundries last year,  has selected Arteris FlexGen smart NoC IP and Magillem SoC integration automation software to help develop domain-specific SoCs. MIPS will integrate Arteris … The post MIPS and Arteris hook up for interconnectivity in customisable SoCs appeared first on Electronics Weekly.

The author Damnang2 has penned an authoritative piece on Substack about the hill Intel has to climb to catch TSMC. Here it is: In Q4 2025, Intel Foundry posted revenue … The post Intel Foundry: The Last Chance appeared first on Electronics Weekly.

Marelli’s in‑cabin innovations aim to show how the  integrate electronics into interiors to elevate comfort and functionality. As vehicle standardisation increases across many areas, advanced technologies that shape both the … The post Marelli’s auto interiors appeared first on Electronics Weekly.

Kyocera Corporation announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs1 and switch ASICs, which are rapidly scaling in complexity as AI data center architectures evolve. The new product will be unveiled at ECTC 2026, an international conference on semiconductor packaging technologies, in Orlando, Florida, USA, May…