Molex has bought Teramount, an Israel-based developer of detachable fibtr-to-chip connectivity products optimised for high volume Co-Packaged Optics (CPO) and other silicon photonics applications. “Teramount’s passive, detachable coupling approach supports large …
The post Molex buys Teramount appeared first on Electronics Weekly.
Nisshinbo Micro Devices has brought out 1-cell Li-ion battery protection ICs in a WLCSP package. The NB7130 is equipped with all standard safety features, such as overcharge/over-discharge voltage, charge/discharge overcurrent … The post 1-cell Li-ion battery protection IC in a WLCSP package. appeared first on Electronics Weekly.
Direct Insight, the system-on-module (SoM) specialist, has released its STM32MP235C-based QSMP-20 module. It features higher availability DDR3L RAM to sidestep AI-driven lead time and supply issues. This is a solder-down … The post Direct Insight’s QSMP-20 SoM for smart devices sidesteps AI memory demand appeared first on Electronics Weekly.
Microchip’s AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) addresses growing demand for Human-Machine Interfaces (HMIs) in automotive and e-mobility applications. Supporting sophisticated graphics and large display sizes (up to 10 inches … The post Microchip’s SAM9X75D5M hybrid MCU SiP targets automotive HMIs appeared first on Electronics Weekly.
As part of our In Conversation With series, we recently caught up with Densitron’s Global Product Director, Bazile Peter. He discusses emerging tactile interface technologies, including haptic solutions, transparent buttons, … The post EW Video: In conversation with Densitron on the future of tactile interfaces appeared first on Electronics Weekly.
As software-level defences reach their limits, attention has shifted toward creating a ‘root of trust’ directly in silicon. This article analyses cutting-edge techniques that enable designers to automate vulnerability detection … The post Emerging tools and techniques for secure hardware design appeared first on Electronics Weekly.
QuInAs Technology, developer of the compound-semiconductor memory technology ULTRARAM, today announced the publication of its latest research in the Journal of Applied Physics. The work links device-level physics — including … The post ULTRARAM to feature at ISQED appeared first on Electronics Weekly.
