Factors leading to semiconductor obsolescence include foundry process technologies, packages, substrates, test platforms and design resources. So, how does the manufacturing supply chain impact long-term product availability? Older semiconductor products typically use through-hole and surface-mount lead frame packages, such as DIP, PLCC, QFP and PGA. However, the market now favors assemblies that do not require trim and form tooling. Why did the industry move away from lead frame assemblies that require trim and form? Exploring assembly…