AlpSemi has completed a €17 million funding round led by Yotta Capital (France) with participation from SE Ventures (Global), Navitas Semiconductor (USA) and Cycle Group (Luxembourg). This financing supports the … The post AlpSemi raises €17m appeared first on Electronics Weekly.
Arm’s AI Optimisation Challenge 2026 is inviting developers to compete for £8000 in prizes by building projects that show how AI can be optimised for Arm-powered platforms across three challenge … The post Arm’s AI Optimisation Challenge appeared first on Electronics Weekly.
China remains the world’s largest semiconductor equipment market, supported by AI demand, memory expansion, and continued fab investments. The synchronized expansion of memory leaders CXMT and YMTC is accelerating … The post China supplying 23% of domestic semi equipment needs and rising appeared first on Electronics Weekly.
Next month ST will begin volume production of a compact direct Time-of-Flight 3D LiDAR all-in-one module which delivers AI-ready output data for low-compute edge AI systems on small MCUs and … The post Compact ToF 3D module has multiple uses appeared first on Electronics Weekly.
Thanks to Any Silicon for this one – the top ten fabless companies in Q1: Nvidia: Broadcom: Qualcomm: AMD: MediaTek: . Marvell: Realtek: OmniVision: Novatek: Monolithic Power Systems (MPS) The post Top Ten Fabless appeared first on Electronics Weekly.
Qualinx, the Dutch connectivity specialist, is sampling a GNSS receiver with full Galileo OSNMA (Open Service Navigation Message Authentication) support on its QLX3Gx Series ultra-low-power GNSS receiver. Developed with the … The post Qualinx sampling GNSS receiver with OSNMA support appeared first on Electronics Weekly.
Trackers are expected to provide geolocation information, both indoors and outdoors, while using many technologies without huge cost, writes Suman Thapa. Each year millions of trackers are deployed across industrial … The post Geolocation equipment needs to evolve to fit market requirements appeared first on Electronics Weekly.
RANsemi Limited, the British 5G O-RAN baseband specialist, and TechPhosis Private, an Indian 5G CU/DU stack solution provider and O-RAN integration specialist, have integrated the Linux Foundation’s open source 5G … The post RANsemi baseband integrates Linux OCUDU CU/DU stack for small cell deployment appeared first on Electronics Weekly.
By growing molybdenum disulfide inside protective tubes of boron nitride, researchers from the University of Tokyo, produced highly uniform tubes one nanometer wide, a scale at which it’s difficult to … The post 1nm wide nanotubes built by Tokyo University researchers appeared first on Electronics Weekly.
Infineon and AWS are launching in Q3 a cloud-based platform to accelerate MCU evaluation to shorten development cycles for automotive systems. The platform removes dependency on hardware, helps to reduce … The post Accelerated MCU evaluation for automotive systems appeared first on Electronics Weekly.
