Today, Infineon opens its €5 billion smart power fab in Dresden. The official ground-breaking ceremony for the fab took place in May 2023 – three years later, on 2 July … The post Infineon opens smart power fab in Dresden appeared first on Electronics Weekly.
Imev is extending the lessons learnt in its Automotive Chiplet Program to an Autonomous Edge Chiplet Program (AECP) as a an acknowledgment that the same foundational HPC building blocks can … The post Imec extends auto chiplet program to edge computing appeared first on Electronics Weekly.
Western Europe experienced an “unusually early and intense” heat wave in late May and now large parts of the continent have been gripped by another heat wave, this one more … The post Europe’s Heat-Stroke appeared first on Electronics Weekly.
NASA has selected eight new companies to take part in its Commercial Satellite Data Acquisition (CSDA) programme. This will expand the range of commercial satellite data it makes available to … The post NASA expands Earth Observation dataset for its CSDA programme appeared first on Electronics Weekly.
Influencers currently wield the biggest power over people’s purchasing decisions in Brazil, South Africa, China and India, according to a survey by Statista Consumer Insights. France,Austria, Belgium, the Netherlands, Sweden … The post Under The Influence appeared first on Electronics Weekly.
Now in its eighth year, the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in … The post EW BrightSparks 2025 profile: Oliver Tatlow, Leonardo appeared first on Electronics Weekly.
Don’t miss the latest episode of our Electronics Weekly podcast, CHIIPS. It features Edward Charrier – Fractilia’s co-founder, CEO and President – and Chris Mack, Fractilia’s co-founder and CTO. The post CHIIPS #35 – CHIIPs with Fractilia’s Edward Charrier and Chris Mack appeared first on Electronics Weekly.
Molex is expanding its automotive HSAutoLink Interconnect portfolio. The HSAutoLink G connector provides multi-gig Ethernet connections of up to 25Gbps. It will address escalating bandwidth demands driven by Advanced Driver-Assistance … The post Molex releases HSAutoLink G automotive Ethernet connector system appeared first on Electronics Weekly.
The semiconductor market divide between AI-driven infrastructure demand and traditional end markets is growing, says Counterpoint’s Q2 Lead Times report. While the market, in general, is experiencing a return to … The post Non-AI lead times normalising appeared first on Electronics Weekly.
The optical transceiver market is expected to grow to more than $112 billion by 2031, driven primarily by AI infrastructure deployments, says Yole Group. AI is reshaping the competitive … The post AI transforming optical receiver market appeared first on Electronics Weekly.
