The modular system, based on NI technology combines a high-performance FPGA core, for processing real-time data, and interchangeable SerDes interface devices which can be swapped according to the configuration requirements […] The post Modular test architecture is driving force for Emerson appeared first on Electronics Weekly.
SWISSto12, the Swiss manufacturer of satellite and payload systems, has closed its $70 million Series C funding round. The capital raise follows the award of $84.8 million from the European […] The post SWISSto12 $70m raises Series C for HummingSat development appeared first on Electronics Weekly.
Molex, a global electronics leader and connectivity innovator, announced a long-term supply agreement with Prysmian, the world’s largest cable solutions provider, to address the surging demand for fiber optic connectivity inside data centers. Fueled by rapid AI-driven data center expansions, Prysmian will supply optical cables to Molex for a period of up to 10 years,…
Bourns announces the release of its SRP2010PA, SRP2510PA, and SRP2512PA Series shielded power inductors designed to support high current operation in space-constrained electronic designs. The new series combines a metal-alloy powder core with shielded construction to reduce magnetic field radiation while maintaining a low-profile package. Designers of automotive and DC-DC conversion circuits continue to face increasing current requirements alongside…
The European Space Agency (ESA) has released its latest Space Economy Report covering the year 2025. It gives an overview of the developments shaping Europe’s space sector. Its findings include […] The post European space funding bucks global trends appeared first on Electronics Weekly.
Mouser Electronics, the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, has released a new eBook in collaboration with onsemi – Powering and Sensing AI: From Cloud Infrastructure to Physical Autonomy. Artificial intelligence is often viewed through the lens of software, algorithms, and large language models. However,…
China president Xi Xinping told the World AI Conference in Shanghai at the weekend: “As ancient Chinese observed: ‘A man of wisdom adapts to changes. A man of knowledge acts […] The post Xi sets out China’s AI stall appeared first on Electronics Weekly.
Semiconductor company shares have lost over $3 trillion in value since June. The SOX is 20% lower than its June high and the iShares Semiconductor ETF is down 15% from […] The post Semi stocks falling appeared first on Electronics Weekly.
Rapidus and Cadence are getting together to advance agentic AI by integrating the Cadence InnoStackAI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native […] The post Cadence and Rapidus hook up on agentic AI appeared first on Electronics Weekly.
Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio – an agentic AI platform for PCB and packaging design which spans system planning to final product […] The post Agentic AI platform for PCB and packaging appeared first on Electronics Weekly.
