Chips were a key element of. China’s first half export surge, reports the South China Morning Post. China exported 179.44 billion chips in H126 with a value up 96%YoY at […]
The post China H1 exports driven by chips appeared first on Electronics Weekly.
German chip designer, Dream Chip has updated its X Series ISP (image signal processor) offering with the X4 series. The ISP-X418 is the latest in the X Series of real-time … The post Dream Chip maps out its ISP upgrades appeared first on Electronics Weekly.
To meet the data-rate, power, and thermal constraints of intracortical Brain Computer Interfaces (BCIs), Imec has developed a neuromorphic compressive telemetry (NCT) chip for lossless, realtime data reduction. The architecture … The post Imec advances neural ICs appeared first on Electronics Weekly.
Photon Bridge, the Dutch photonics specialist, will use Phix, the photonics packaging house, to put Photon Bridge’s DWDM external laser source Transmit Optical Sub-Assembly (TOSA) (pictured) into a module for … The post Photon Bridge and Phix take TOSA module to market appeared first on Electronics Weekly.
Rapidus and Cadence are getting together to advance agentic AI by integrating the Cadence InnoStackAI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native […] The post Cadence and Rapidus hook up on agentic AI appeared first on Electronics Weekly.
Taipei, Taiwan, 9th July 2026 —Advantech is proud to introduce its latest edge AI solutions powered by the Qualcomm® Dragonwing IQ-9075 processor, including the AOM-6741 SMARC module, ASR-A503 and AFE-A503 robotic controller, and AIR-055VV edge AI system. Designed for industrial-grade vision intelligence, these platforms enable a new generation of edge AI applications by delivering up…
ECCO’s president, Bernard Gizzi ECCO’s president, Bernard Gizzi, explains why connectors can be hard to source and how to avoid supply chain interruptions and cost escalations. In the past, sourcing interconnect solutions, especially connectors, usually came after key decisions for board-level semiconductors and other high-cost, highly differentiated components. Moreover, silicon and many active components are…
