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The advanced packaging market reached $55 billion in 2025 and is expected to increase to more than $120 billion by 2031, says Yole. Advanced packaging is overtaking traditional packaging to […] The post Advanced packaging market to hit $120bn by 2031 appeared first on Electronics Weekly.

TT Electronics is celebrating its Hallogic Hall-effect sensors being selected as part of Nasa’s Dragonfly Mission, which will send a robotic rotorcraft to a moon of Saturn. Specifically, it will … The post Nasa selects TT Electronics’ Hallogic sensors for Dragonfly Mission appeared first on Electronics Weekly.

Stackpole is expanding its CSSU series of high-power metal alloy current sense resistors with 0.5 mΩ and 20 mΩ options. The new 0.5 mΩ resistor enables lower power dissipation and … The post Stackpole expands CSSU series of current sense resistors appeared first on Electronics Weekly.

The past few years of elevated inflation, high cost of living and stagnant real wages have sent American hopes for future (real) income growth near to all-time lows. According to … The post Americans Lose Hope Of Income Growth appeared first on Electronics Weekly.

There is unsustainable overfishing in the South China Sea,the Eastern Central Atlantic close to West Africa, the Mediterranean,the Black Sea. the Southeast Pacific off the coast of South America, the … The post Overfishing appeared first on Electronics Weekly.

Newark’s global head of solutions, Cliff Ortmeyer, outlines the practical considerations engineers should consider when selecting electronics cooling technologies   Engineers approach thermal management as a primary design constraint. At a high level, every design starts with assumptions about available power, enclosure type and operating environment. These factors define the thermal envelope and influence decisions throughout the development process.   Maintaining thermal margin helps extend operational…