Nobody’s Worry

Newark’s global head of solutions, Cliff Ortmeyer, outlines the practical considerations engineers should consider when selecting electronics cooling technologies   Engineers approach thermal management as a primary design constraint. At a high level, every design starts with assumptions about available power, enclosure type and operating environment. These factors define the thermal envelope and influence decisions throughout the development process.   Maintaining thermal margin helps extend operational…

Imev is extending the lessons learnt in its Automotive Chiplet  Program to an Autonomous Edge Chiplet Program (AECP) as a an acknowledgment that the same foundational HPC building blocks can … The post Imec extends auto chiplet program to edge computing appeared first on Electronics Weekly.

Schurter has bought a majority stake in Biaodi, the Wuhan, China-based  of developer of high‑voltage circuit protection products for electric vehicles and new energy applications. “Biaodi fills key gaps in […] The post Schurter buys majority stake in Biaodi appeared first on Electronics Weekly.

Murata has introduced the GCJ21BD72A225KE02, a soft-termination chip multilayer ceramic capacitor (MLCC) for automotive powertrain and safety equipment. This soft-termination chip MLCC product claims  the highest available capacitance of 2.2μF … The post MLCC with capacitance of 2.2μF at 100Vdc appeared first on Electronics Weekly.

Onsemi is to buy Synaptics in an all-stock deal valued at about $6.2 billion. Synaptics was founded in 1986 by two legendary pioneers of the semiconductor industry – Federico Faggin … The post Onsemi buys Synaptics appeared first on Electronics Weekly.

At the 2000 ISS Taiwan the talk was about how the cell phone would impact the PC with the phone expected to become more datacentric and the PCs more portable, […] The post When Phones Threatened PCs appeared first on Electronics Weekly.