To avoid the need for multi-patterning in 1.4nm and 1nm processes, High-NA EUV will be needed, says imec. ‘For A14 and A10 logic nodes, requirements for the most critical metal …
The post 1.4nm single-patterned processes need High NA, says imec appeared first on Electronics Weekly.
Molex has completed the acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedized custom connectors, … The post Molex buys Smiths Interconnect appeared first on Electronics Weekly.
Contract Production invites readers of Electronics Sourcing to discover the benefits of building long-term manufacturing partnerships, including improved product quality. In the continually evolving, fast-paced world of technology, Contract Production has spent the last 15 years successfully established itself as a frontrunner in UK contract electronic manufacturing, building longstanding partnerships across a wide range of sectors….
SiTime is sampling the Elite 2 Super-TCXO which aims to increase GPU utilisation and improve compute efficiency in AI datacentres by delivering better time synchronisation. The chip targets a $1.5 … The post SiTime TCXO enhances GPUs appeared first on Electronics Weekly.
TSMC’s Q1 profit was up 58% YoY at $18.2 billion on Q1 revenue of $35.90 billion which was up 40.6% YoY and up 6.4% from Q4 2025. Gross margin for … The post TSMC Q1 profit up 58% YoY appeared first on Electronics Weekly.
Thanks to TrendForce for this one – the top ten smartphones in Q4: The post Top Ten Smartphones In Q4 appeared first on Electronics Weekly.
Segger is supporting the OnMicro OM662X series of ultra-low-power Bluetooth SoCs in its J-Link debug probes and Flasher in-system programmers. Functionality includes unlimited breakpoints in RAM and flash memory and … The post Segger flashes support for OnMicro OM662X ULP Bluetooth SoCs appeared first on Electronics Weekly.
