Shrinking packaging, particularly with wire bond devices, and increasing automation, means that metrology has to adapt to meet the micro-level inspection required for reliable production lines. View Micro Metrology is …
The post Metrology tools for wire bonded chips appeared first on Electronics Weekly.
OpenAI says it is pausing its Stargate datacentre project in the UK. “We see huge potential for the UK’s AI future,” says OpenAI, “AI compute is foundational to that goal … The post OpenAI ditches UK Stargate datacentre appeared first on Electronics Weekly.
Researchers at the University of Cambridge have proposed an answer to escalating energy consumption of AI hardware – multicomponent p-type Hf(Sr,Ti)O2 thin films for memristor-based neuromorphic devices. ‘Neuromorphic computing offers … The post Cambridge researchers propose Hf(Sr,Ti)O2 memristors for neuromorphic devices. appeared first on Electronics Weekly.
Almost 35,000 space objects of the size of a softball or above are currently known to exist in orbit. Data from the General Catalogue of Artificial Space Objects shows how … The post Crowded Space appeared first on Electronics Weekly.
The Siglent SNA5000X-E vector network analyser (VNA) series, designed for RF measurement, is now available from Telonic Instruments. The two models in the SNA5000X-E series can be used for determining … The post Telonic adds Siglent SNA5000X-E VNAs appeared first on Electronics Weekly.
The post Invisible Architects of Miniaturization – SMD Resistors in Modern Electronics appeared first on Electronics Weekly.
Posifa Technologies is introducing its PGS5100 series of MEMS thermal conductivity hydrogen sensors. They are designed to provide early warning of abnormal conditions inside EV battery packs and other demanding … The post Posifa hydrogen sensor monitors EV battery safety and leaks appeared first on Electronics Weekly.
