Molex’s Co-Packaged Copper connector system

Semiconductor wafer demand (12” equivalent) reached 8.7 million wpm last year, says Yole Group, with the foundry industry earning 47% of all wafer manufacturing revenue, worth $181 billion, last year … The post Foundry capacity underutilised but revenues and market share growing appeared first on Electronics Weekly.

Prototypes of Z-Angle Memory (ZAM) are slated for 2027, says Intel, with mass production scheduled for 2030. ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage … The post ZAM challenge to HBM appeared first on Electronics Weekly.

Mikroe’s EnOcean 5 Click provides a bidirectional communication interface for EnOcean-based sensors, switches, and actuators. “This new Click board is ideal for developing energy-efficient dimmers, relays, and shutter controllers that … The post Mikroe EnOcean 5 Click appeared first on Electronics Weekly.

Alibaba’s research arm, Damo Academy, has launched a RISC-V based CPU for AI inference which can be customised to a user’s workload and is claimed to be the highest-performing RISC-V … The post Alibaba launches 5nm RISC-V CPU for inference appeared first on Electronics Weekly.

Qorvo’s QPD1011A is a 7W (P3dB), 50-Ohm input-matched discrete GaN on SiC HEMT which operates from 30 MHz to 1200 MHz. The integrated input matching network enables wideband gain and … The post 7W, 30-1200 MHz, GaN RF Input-Matched Transistor appeared first on Electronics Weekly.

TDK is expanding its NTCSP series of NTC thermistor components with two new options. For temperature detection and temperature compensation, they are primarily aimed at automotive power modules. For example, … The post TDK expands NTC thermistor series for automotive power modules appeared first on Electronics Weekly.