At the ISSCC yesterday, CEA-List and CEA-Leti presented an electro-optical router with dynamic, frame-level optical routing integrated with CMOS control logic – an enabler for chiplet-based optical networking. Their paper, …
The post ISSCC: Electro-optical router in a chiplet package appeared first on Electronics Weekly.
Looking at only those written in the last week, the most popular stories on our website involve Cadence launching its ChipStack AI Super Agent, silicon wafer shipments in 2025, and Google funding datacentre construction. The post Most Read – Edinburgh Uni research, Datacentre builds, Agentic AI tool appeared first on Electronics Weekly.
PLS unveiled its Universal Debug Engine (UDE) 2026 at Embedded World in Nuremberg. As well as new features, the range of supported high-end MCUs and embedded processors has also been … The post PLS extends UDE 2026 for sampling via debug interfaces appeared first on Electronics Weekly.
Datacentre capex will hit $1.7 trillion in 2030, says Dell’Oro. Hyperscale and neo cloud service providers, along with sovereign AI initiatives, are entering a new phase of infrastructure expansion. “The … The post $1.7trn 2030 datacentre capex appeared first on Electronics Weekly.
TSMC said at the weekend that it will hire 8000 more people this year. Engineer recruits with a Masters will be paid an average of $70k. The new hires are … The post TSMC to hire 8000 new people this year appeared first on Electronics Weekly.
We’re training up an AI to be a humanised version of the PM, Ed confides to his diary, jokes, empathy, common sense are all being fed into the model. The … The post Ed Refurbs The PM appeared first on Electronics Weekly.
Don’t miss the latest episode of the excellent Electronics Weekly podcast, CHIIPS. It features Thomas Andersen, head of the AI and ML solutions group at Synopsys. The post CHIIPS #26 – AI automation from Thomas Andersen of Synopsys appeared first on Electronics Weekly.
